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Capability


Item
Volume
Prototype/Small volume

PCB specification 
of SMT operation

Length x Width Minimum 50 x 30mm L<50mm?or?W<30mm
Maximum 510 x 460mm 800>L>510mm
Thickness Minimum 0.2mm
Maximum 5mm T>5mm
PCB specification 
of DIP operation
Length x Width Minimum 50 x 30mm L<50mm
Maximum 510 x 460mm 1000>L>510mm
Thickness Minimum 0.4mm
Maximum 5mm T>5mm
Specification of SMT component Outline size Min. specifications 0603(0201) 0602(01005)
Max. size 45 x 45mm 68x68mm(45x150mm)
Thickness of component 25.4mm T>25.4mm
QFP/SOP/SOJ/IC Socket etc. Min. distance of PIN Pitch=0.4mm Pitch=0.3mm
CSP, BGA Min. distance of BGA ball Pitch=0.5mm Pitch=0.3mm

AOI
Automatic Printer
Electronic Material Warehouse
JUKI FX-3RAL
JUKI KE-1070L

Maintenance Shop
Warehouse

Wave Soldering
X-ray

OUR CERTIFICATIONS

  • - Approved UL manufacturer, 
  • - Certified ISO 9001, TS 16949 and ISO 14001

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CONTACT

 Add: unit5,WanXia industry Park GongHe Village,

  ShaJing Town, ShenZhen.China

       86 755 329 22026  

          +86 134 3443 0373 

       sales@hescon-pcb.com