Our Production Capability

Item Standard Advanced
Number of layers UP TO 14 UP TO 16
Laminate FR-4, Halogen free, CEM-3, PTFE
Max board size 610X460 mm 1016X610mm
Board Thickness 0.45-3.2 mm 0.3-3.5mm
Minimum line width/space 0.076/0.076mm
Minimum line width/space tolerance +/-15% +/-10%
Outer layer copper thickness 140 um 210um
Inner layer copper thickness 70um 140um
Min. finished hole size(Mechanical) 0.20mm 0.15mm
Aspect Ratio 8 :1 10 :1
Impedance Control Tolerance 8%
Surface treatment Flash Gold 0.025-0.2um 0.025-0.5um
Immersion gold 0.025-0.2um 0.025-0.125um
Sn/Pb HASL 0.025-0.125 um 0.025-0.125 um
Leadfree HASL 1-70 um 1-70 um
Immersion Silver 0.2-0.4 um
OSP (Entek) 0.375-1.75 um 0.375-1.75 um
Gold Finger 0.375um< X ≤ 1.75um ≥1.75um
Hard Gold Plating 0.375um< X ≤ 1.76um ≥1.76um
Immersion Sn 0.8um < X ≤ 1.2um
Gold Finger 0.375um< X ≤ 1.75um ≥1.75um
Hard Gold Plating 0.375um< X ≤ 1.76um ≥1.76um
V-Cut V-cut Degree 20° ,30° ,45° ,60°
Outline Profile
Item Standard Advanced
Chamfer The angle type of the chamfer 30°,45°,60°
Largest NPTH hole size 6.5mm > 6.5mm
Largest PTH hole size 6.5mm > 6.5mm
Min. annular ring can be kept 6mil 4mil
Min. distance between the IC for SM bridge 0.25mm 0.25m
Min.SM bridge for green solder mask 0.1mm 0.076mm
Min.SM bridge for black solder mask 0.125mm 0.1mm
Tolerance of dimension size ±0.1mm ±0.08mm
Tolerance of board thickness ±10% < ±8%
Tolerance of finished NPTH hole size ±0.05mm ±0.03mm
Tolerance of finished PTH hole size ± 0.076mm ±0.05mm
Delivery time sample:3-5 days mass production:10-12 days
Capacity 5000sqm/day 70000sqm/month
CAM capability 50 part numbers/days