Technology is ever-changing. Designs of printed circuit boards continue to become more advanced each day. Therefore, to be able to say yes to technology, HESCON challenges its engineering team on a daily basis. Because of these challenges, HESCON is proud to say yes to a Broad Range of Technologies. It has led our company to higher layer counts in through-hole technology and to take the lead in advanced and emerging technologies. HESCON now routinely helps design and manufacture High Density Interconnect (HDI) product.